Honor X6b Plus vs TCL 505

Honor X6b Plus
Honor
X6b Plus
TCL 505
TCL
505

Sekilas

Merek
Honor
TCL
Tanggal rilis
November 2024, 1 tahun 7 bulan lalu
Februari 2024, 2 tahun 4 bulan lalu
AnTuTu
222.000 Antutu v10 Overall performance better than 56% of devices
125.000 Antutu v9 Overall performance better than 53% of devices

Layar

Ukuran
6.56"
6.75"
Resolusi
720 x 1612 px HD+
720 x 1600 px HD+
Tipe
TFT LCD (IPS)
LCD IPS
Kerapatan
270 ppi Medium Density
260 ppi Medium Density
Rasio aspek
20:9
20:9
Fitur
Water Drop Notch, Max brightness HBM - 500 cd/m², 83% NTSC, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless
Water Drop Notch, Refresh rate 90 Hz, Scratch resistant, 2.5D curved glass screen, Capacitive, Multi-touch, Frameless

Performa

Chipset
MediaTek Helio G85 (MT6769V/CZ)
Mediatek Helio G35
CPU
2x Cortex A75 2.0 GHz + 6x Cortex A55 1.8 GHz
8x Cortex A53 2.3 GHz
Tipe CPU
Octa-Core
Octa-Core
Proses
12 nm
12 nm
Frekuensi
2 GHz
2.3 GHz
GPU
Arm Mali-G52 MC2 950MHz
IMG PowerVR GE8320 680MHz
RAM
4 GB
4 GB
64-bit
Yes
Yes
Tipe RAM
LPDDR4X RAM

Kamera belakang

Resolusi
50 Mpx
50 Mpx
Aperture
ƒ/ 1.8
ƒ/ 1.8
Lampu kilat
LED
LED
Stabilisasi optik
No
No
Gerak lambat
Yes, 120 fps
No, 30 fps
Fitur
Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer, Front Flash
Digital zoom, Dual camera, Autofocus, Touch focus, Phase detection autofocus (PDAF), Continuous shooting, Geotagging, Panorama, HDR, Face detection, White balance settings, ISO settings, Exposure compensation, Scene mode, Self-timer
Sensor
Hynix Hi-5021Q
Ukuran piksel
0.70 µm
Ukuran sensor
1/2.55"

Kamera depan

Resolusi
5 Mpx
5 Mpx
Aperture
ƒ/ 2.2
ƒ/ 2.2

Baterai

Kapasitas
5200 mAh
5010 mAh
Tipe
Li-Polymer
Li-Polymer
Pengisian cepat
Yes , 35.0W
Yes , 10.0W
Fitur
Non-removable
Non-removable

Penyimpanan

Kapasitas
128 GB
64 GB
Slot SD
Yes , Independent SD slot
Yes , Slot for SD or second SIM card
Tipe
eMMC 5.1 Storage

Bodi

Dimensi
75.3 mm 163.6 mm 8.4 mm Print 3D Model
76.7 mm 168.3 mm 8.3 mm Print 3D Model
Berat
192 g
190 g
Bahan
Plastic , Splash resistant design
Polycarbonate
Warna
Black Purple Green Cyan
Black Blue
Tahan air/debu
IP54
Permukaan yang dapat digunakan
83 %
85 %

Perangkat lunak

Sistem operasi
Android 14 Upside-down cake Android 14
Android 14 Upside-down cake Android 14
Pembaruan
OS updates: 2 years, Security updates: 3 years
Layanan Google
With Google Mobile Services
With Google Mobile Services

Konektivitas

SIM
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Dual SIM Dual Standby (Nano SIM + Nano SIM)
Bluetooth
Bluetooth 5.1 LELow energy consumption
Bluetooth 5.1 LELow energy consumption
Profil Bluetooth
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy), APT-x, LDAC, SBC, AAC
A2DP (Advanced Audio Distribution Profile), EDR (Enhanced Data Rate), LE (Low Energy)
Wi-Fi
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
802.11a , 802.11b , 802.11g , 802.11n , 802.11n 5GHz , 802.11ac
Fitur Wi-Fi
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
Dual band, Wi-Fi Hotspot, Wi-Fi Direct, Wi-Fi Display
USB
USB Type-C
USB Type-C
Fitur USB
Charging, OTG
Charging, OTG
Navigasi
GPS, A-GPS, GLONASS, Beidou, Galileo
GPS, A-GPS, GLONASS, Beidou, Galileo

Jaringan

4G LTE
B1 (2100), B2 (1900), B3 (1800), B4 (1700/2100 AWS 1), B5 (850), B7 (2600), B8 (900), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
B1 (2100), B3 (1800), B5 (850), B7 (2600), B8 (900), B20 (800), B28b (700), B28a (700), B38 (TDD 2600), B40 (TDD 2300), B41 (TDD 2500)
3G
B1 (2100), B4 (1700/2100 AWS A-F), B5 (850), B8 (900)
B1 (2100), B2 (1900), B5 (850), B8 (900)
2G
B2 (1900), B3 (1800), B5 (850), B8 (900)
B2 (1900), B3 (1800), B5 (850), B8 (900)

Sensor & keamanan

Sidik jari
Yes, on the side
Yes, on the side
Akselerometer
Yes
Yes
Giroskop
Yes
Proksimitas
Yes
Yes
Sensor cahaya
Yes
Yes
Sistem pendingin
No
No

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